JPH01127281U - - Google Patents
Info
- Publication number
- JPH01127281U JPH01127281U JP2400488U JP2400488U JPH01127281U JP H01127281 U JPH01127281 U JP H01127281U JP 2400488 U JP2400488 U JP 2400488U JP 2400488 U JP2400488 U JP 2400488U JP H01127281 U JPH01127281 U JP H01127281U
- Authority
- JP
- Japan
- Prior art keywords
- fpc
- fpcs
- deformation hole
- ink
- coverlay
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2400488U JPH01127281U (en]) | 1988-02-24 | 1988-02-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2400488U JPH01127281U (en]) | 1988-02-24 | 1988-02-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01127281U true JPH01127281U (en]) | 1989-08-31 |
Family
ID=31243478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2400488U Pending JPH01127281U (en]) | 1988-02-24 | 1988-02-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01127281U (en]) |
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1988
- 1988-02-24 JP JP2400488U patent/JPH01127281U/ja active Pending